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Batch Thermal Process System (QUIXACE)
QUIXACE Batch Thermal Process System for 300mm Wafers

QUIXACE is KOKUSAI ELECTRIC CORPORATION's latest platform for batch thermal processing for 300 mm wafers. The QUIXACE offers high throughput with various advanced technologies such as temperature control, wafer handling automation, reactor purging, and temperature ramping, etc. KOKUSAI ELECTRIC CORPORATION is proud to offer the QUIXACE as the latest platform for today's manufacturing environment and solutions for tomorrow's challenges.

※QUIXACE is a registered trademark of KOKUSAI ELECTRIC CORPORATION
Process Applications
LP CVD
Oxidation
Anneal
Features
Batch configurations adaptable for large and small load-sizes (50-125 wafers/batch)
High Throughput by Short Cycle Time
Minimum Scheduled Down Time by In-Situ Gas Cleaning
Fast ramp up / down heater, High speed wafer transfer automation
Vacuum load lock type (N2 Purge type) available for oxygen and moisture sensitive process (high cleanliness and lower oxygen concentration). (Optional)